Engineering disciplines under one roof
Our systems combine optics, electronics, firmware and mechanics. Keeping these disciplines together is what makes advanced capability achievable at a rational price.
Thermal imaging
Uncooled long-wave infrared sensing, image processing and thermal presentation tuned for observation and detection tasks.
Electro-optics
Optical design, alignment and integration of infrared optics with existing night vision optical paths.
Embedded systems
Low-power embedded electronics developed around real operating conditions rather than benchtop performance alone.
Sensor integration
Combining imaging and auxiliary sensing into coherent devices with predictable behaviour.
Software & firmware
Image pipelines, device control and calibration routines developed in-house alongside the hardware.
Mechanical engineering
Precise housings, mounting interfaces and thermal paths designed for compact, rugged assemblies.
System integration
Bringing optics, electronics, firmware and mechanics together as one engineered product.